Ignitarium
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Ignitarium Company Information
Ignitarium is a company that specializes in semiconductor design, multimedia & imaging, connectivity, cloud & enterprise, and machine learning & deep neural networks. The company is ISO/IEC 27001:2022 and ISO 9001:2015 certified, ensuring high standards in information security and quality management. Ignitarium offers a comprehensive suite of services including architecture consulting, digital design & verification, FPGA design & emulation, AMS verification, DFT, and physical design. Additionally, they provide embedded software services, digital software services, analytics, and robotics solutions. Ignitarium has developed several AI platforms such as TYQ-i® for defect detection and quality assurance, FLK-i® for safety, compliance, and automation, and Septra® for voice-controlled human-machine interactions. The company partners with industry leaders like NVIDIA, Texas Instruments, and Renesas to deliver cutting-edge solutions for human pose detection, OCR/pattern recognition, behavior monitoring, attire & PPE detection, real-time color detection, missing artifact detection, and real-time manufacturing line inspection. Ignitarium also offers ground-based infrastructure analytics and aerial analytics. Their expertise extends to developing purpose-built solutions leveraging NVIDIA’s software frameworks, tools, and hardware platforms, with over 25,000 GPU cores in their R&D labs. They provide a pre-trained AI library for Vision AI-based software applications on Renesas devices and solutions for head counting, driver monitoring systems, attire detection, animal detection, access control, office room usage monitoring, human gaze detection, and elderly fall detection. The company has also developed a vacuum cleaner robot using RA6M5 and RZ/V2L with ROS2 and Micro ROS. Furthermore, Ignitarium offers services in sensor modalities & sensor fusion, system integration, and functional safety for autonomous mobile robots. Their design for test (DFT) services include DFT architecture definition, RTL modification, low power and topographical synthesis, hierarchical DFT implementation, and full-chip porting.