Atomica Corp

Atomica Corp specializes in a wide array of MEMS (Micro-Electro-Mechanical Systems) applications, encompassing photonics, sensors, biochips, and custom MEMS solutions. The company provides MEMS-based solutions for industries such as cloud computing, autonomous vehicles, cell therapy, molecular diagnostics, genomics, 5G, and the Internet of Things (IoT). Atomica’s photonics technologies support optical communications, 3D sensing and LiDAR, augmented/virtual reality (AR/VR), thermal imaging, illumination, and other optical sensing applications. Their manufacturing capabilities include MEMS for thermal imaging, inertial measurement, microphones, gas and chemical detection, biological sensing, magnetics, and pressure sensors. Atomica also has significant expertise in microfluidic biochips, including drug-delivery devices, neural probes, cell sorters, biosensors, DNA synthesis, and sequencing. They offer custom design and production support for nearly any type of MEMS device. Atomica operates the largest pure-play MEMS production fab in the United States, featuring a 130,000 ft² manufacturing campus with a 30,000 ft² class 100 cleanroom in Santa Barbara, California. The company is ISO 9001 certified and ITAR registered, and their MEMS foundry is equipped with over 400 tools for both 6” and 8” wafer production. Atomica’s capabilities include design, photolithography, deposition, etching, wafer bonding, wafer-level packaging, through-silicon vias (TSVs), backend processing, and testing. Recently, Atomica raised $30 million in Series C financing to expand its foundry capabilities and support domestic production of biochips, sensors, and photonic circuits. Additionally, the company acquired $50 million worth of advanced semiconductor processing tools to enhance its MEMS manufacturing capabilities. Atomica’s MEMS relay and switch platform offers improvements in size, power, reliability, and speed over traditional relay technologies and is configurable for RF and high-power DC applications, handling up to 40A and above. Their silicon optical benches (SiOBs) enable wafer-level optical integration, improving cost, precision, and size of micro-optic systems. Atomica’s wafer-level packaging (WLP) technology supports high vacuum packaging and complex integration of multiple wafers, while their through-silicon vias (TSVs) allow electrical signals to pass through substrates, enabling smaller device sizes and reduced signal paths. Their backend processing services include wafer thinning, chemical mechanical polishing, and wafer dicing, and their testing capabilities encompass in-process testing, metrology, failure analysis, and automated electric probing.